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1/12 www.rohm.com 201 1.10 - rev . b ? 2011 rohm co., ltd. all rights reserved. s t andard ldo regulators s t andard fixed output ldo regulators with shut down switch b d 3 3 c 0 aw f p , b d 5 0 c 0 aw f p description the bdxxc0awfp series is low-saturation regulator. this ic has a built-in over-current protec tion circuit that prevents the destruction of the ic due to output short circuits and a thermal shutdown circuit that protects the ic from thermal damage due to overloading. f eat ures 1) output current: 1a 2) output voltage: 3.3v 5.0v 2) high output voltage precision : 1% 3) low saturation with pdmos output 4) built-in over-current protection circuit that prevents the destruction of the ic due to output short circuits 5) built-in thermal shutdown circuit for protecti ng the ic from thermal damage due to overloading 6) low esr capacitor 7) to252-5 packaging ap pli c ati ons audiovisual equipments, fpds, televisions, per sonal computers or any other consumer device abs o lute maxim u m ratings (ta=25 ) parameter symbol ratings unit supply voltage *1 vcc -0.3 ~ +35.0 v output control voltage v ctl -0.3 ~ +35.0 v power dissipation (to252-5) *2 pd 1.3 w operating temperature ra nge topr -40 ~ +105 storage temperature range tstg -55 ~ +150 maximum junction temperature tjmax +150 *1 not to exceed pd. *2 to252-5:reduced by 10.4mw / over ta = 25 , when mounted on glass epoxy board: 70mm 70mm 1.6mm. note : this product is not designed for protection against radioactive rays. o per atin g con d it io ns (ta=25 ) parameter symbol min. max. unit supply voltage vcc vo+1v 26.5 v output control voltage v ctl 0 26.5 v output current io 0 1.0 a no.11022ebt01 downloaded from: http:///
technical note 2/12 www.rohm.com 201 1.10 - rev . b ? 2011 rohm co., ltd. all rights reserved. b d 3 3 c 0 aw f p , b d 5 0 c 0 aw f p electrical character i stics BD33C0AWFP(unless otherwise specified, ta=25 , vcc=8.3v,v ctl =5v,io=0ma) parameter symbol min. typ. max. unit conditions shut down current isd 0 10 a v ctl =0v bias current ib 0.5 1.0 ma output voltage vo 3.267 3.300 3.333 v io=200ma dropout voltage vd 0.4 0.7 v vcc=vo 0.95, io=500ma ripple rejection r.r. 45 55 db f=120hz,ein *1 =1vrms, io=100ma line regulation reg.i 20 60 mv vo+1v 25v load regulation reg.l vo 0.010 vo 0.020 v io=5ma 1a temperature coefficient of output voltage tcvo.1 +0.04 %/ io=5ma,tj=-40 -20 tcvo.2 0.005 %/ io=5ma,tj=-20 +105 ctl on mode voltage vthh 2.0 v active mode ctl off mode voltage vthl 0.8 v off mode ctl bias current ictl 25 50 a *1 ein : input voltage ripple bd50c0awfp(unless otherwise specified, ta=25 , vcc=10v,v ctl =5v,io=0ma) parameter symbol min. typ. max. unit conditions shut down current isd 0 10 a v ctl =0v bias current ib 0.5 1.0 ma output voltage vo 4.950 5.000 5.050 v io=200ma dropout voltage vd 0.3 0.5 v vcc=vo 0.95, io=500ma ripple rejection r.r. 45 55 db f=120hz,ein *1 =1vrms, io=100ma line regulation reg.i 20 60 mv vo+1v 25v load regulation reg.l vo 0.010 vo 0.020 v io=5ma 1a temperature coefficient of output voltage tcvo.1 +0.04 %/ io=5ma,tj=-40 -20 tcvo.2 0.005 %/ io=5ma,tj=-20 +105 ctl on mode voltage vthh 2.0 v active mode ctl off mode voltage vthl 0.8 v off mode ctl bias current ictl 25 50 a *1 ein : input voltage ripple downloaded from: http:///
technical note 3/12 www.rohm.com 201 1.10 - rev . b ? 2011 rohm co., ltd. all rights reserved. b d 3 3 c 0 aw f p , b d 5 0 c 0 aw f p electrical characteristic curves (reference data) BD33C0AWFP(unless otherwise specified, ta=25 , vcc=8.3v,v ctl =5v,io=0ma) 0 1 2 3 4 5 6 130 140 150 160 170 180 190 ambient temperature ta [ ] output voltage vo [v] 0 100 200 300 400 500 600 700 800 0 200 400 600 800 1000 output current io [ma] dropout voltage vd [mv] 0 1 2 3 4 5 6 0246 81012141618202224 supply voltage vcc [v] output voltage : vo [v] 0 10 20 30 40 50 60 70 80 90 100 024681012141618202224 control voltage v ctl [v] circuit current i ctl [ a] 0.0 0.2 0.4 0.6 0.8 1.0 0 200 400 600 800 1000 output current io [ma] circuit current ib+i feedback _r [ma] 0 1 2 3 4 5 6 0 2 4 6 8 1012141618202224 control voltage v ctl [v] output voltage vo [v] 0 1 2 3 4 5 6 0 400 800 1200 1600 2000 output current io[ma] output voltage vo [v] 0 1 2 3 4 5 6 024681012141618202224 supply voltage vcc [v] output voltage vo [v] 0 1 2 3 4 5 6 - 40 - 20 0 20 40 60 80 100 ambient temperature ta[ ] output voltage vo [v] 0.0 0.2 0.4 0.6 0.8 1.0 024681012141618202224 supply voltage vcc [v] circuit current ib+i feedback _r [ma] fig.7 ripple rejection (lo=100ma) fig.12 thermal shutdown circuit characteristics fig.1 circuit current fig.2 shut down current fig.3 line regulation (io=0ma) fig.4 line regulation (io=500ma) fig.5 load regulation fig.6 dropout voltage (vcc=vo 0.95v) (lo=0ma 1000ma) fig.8 output voltage temperature characteristics fig.10 ctl voltage vs ctl current fig.11 ctl voltage vs output voltage fig.9 circuit current (lo=0ma 1000 ma) 0 3 6 9 12 15 18 0246 81012141618202224 supply voltage vcc [v] stanby current isd [ a] frequency f [hz] ripple rejection r.r. [db] downloaded from: http:///
technical note 4/12 www.rohm.com 201 1.10 - rev . b ? 2011 rohm co., ltd. all rights reserved. b d 3 3 c 0 aw f p , b d 5 0 c 0 aw f p electrical characteristic curves (reference data) bd50c0awfp (unless otherwise specified, ta=25 , vcc=10v,v ctl =5v,io=0ma) 0 1 2 3 4 5 6 130 140 150 160 170 180 190 ambient temperature ta [ ] output voltage vo [v] 0 10 0 20 0 30 0 40 0 50 0 60 0 0 2 00 40 0 6 00 80 0 1 00 0 output current io [ma] dropout vo ltag e vd [mv] 0 1 2 3 4 5 6 024681012141618202224 supply voltage: vcc [v] output voltage : vo [v] 0 10 20 30 40 50 60 70 80 90 100 0 2 4 6 8 10 12 14 16 18 20 22 24 control voltage vctl[v] circuit current: i ctl[a] 0.0 0.2 0.4 0.6 0.8 1.0 0 200 400 600 800 1000 output current io [ma] circuit current ib+i feedback _r [ma] 0 1 2 3 4 5 6 -40-200 20406080100 ambient temperature ta[ ] output voltage vo [v] 0 1 2 3 4 5 6 0246 81012141618202224 control voltage vctl[v] output voltage vo [v] 0 1 2 3 4 5 6 0 400 800 1200 1600 2000 output current io[ma] output voltage vo [v] 0 1 2 3 4 5 6 0246 81012141618202224 supply voltage: vcc [v] output voltage : vo [v] 0.0 0.2 0.4 0.6 0.8 1.0 0246 81012141618202224 supply voltage vcc [v] circuit current: ib+i feedback _r [ma] 0 3 6 9 12 15 18 024681012141618202224 supply voltage vcc [v] stanby current isd [ a] fig.19 ripple rejection (lo=100ma) fig.24 thermal shutdown circuit characteristics fig.13 circuit current fig.14 shut down current fig.15 line regulation (io=0ma) fig.16 line regulation (io=500ma) fig.17 load regulation fig.18 dropout voltage (vcc=vo 0.95v) (lo=0ma 1000ma) fig.20 output voltage temperature characteristics fig.22 ctl voltage vs ctl current fig.23 ctl voltage vs output voltage fig.21 circuit current (lo=0ma 1000 ma) frequency f [hz] ripple rejection r.r. [db] downloaded from: http:///
technical note 5/12 www.rohm.com 201 1.10 - rev . b ? 2011 rohm co., ltd. all rights reserved. b d 3 3 c 0 aw f p , b d 5 0 c 0 aw f p me asur ement cir c uit for refe re nce d a t a me as urem ent circ uit for refer enc e dat a bdxxc0awfp ( ):vo=5.0v measurement circuit of fig.1 and fig.13 a vcc ctl gnd vo 5v 1 f a vcc ctl gnd vo vcc ctl gnd vo 5v vcc ctl gnd vo 5v vcc ctl gnd vo 5v vcc ctl gnd vo 5v vcc ctl gnd vo 5v vcc ctl gnd vo 5v vcc ctl gnd vo 5v vcc ctl gnd vo 10v vcc ctl gnd vo 10v vcc ctl gnd vo 5v v v 500ma a a 4.75v v 100ma 10v 10v a a 10v v 10v 10v 1vrms 1 f 1 f 1 f 1 f 1 f 1 f 1 f 1 f 1 f v 1 f v 1 f n.c. n.c. n.c. n.c. n.c. n.c. n.c. n.c. n.c. n.c. n.c. n.c. (1.0 f) 2.2 f (1.0 f) 2.2 f (1.0 f) 2.2 f (1.0 f) 2.2 f (1.0 f) 2.2 f (1.0 f) 2.2 f (1.0 f) 2.2 f (1.0 f) 2.2 f (1.0 f) 2.2 f (1.0 f) 2.2 f (1.0 f) 2.2 f (1.0 f) 2.2 f measurement circuit of fi g.2 and fig.14 measurement cir cuit of fig.3 and fig.15 measurement circuit of fig.4 and fig.16 measurement circuit of fig.5 and fig.17 measurement circuit of fig.6 and fig.18 measurement circuit of fig.7 and fig.19 measurement circuit of fig.8 and fig.20 measurement circuit of fig.9 and fig.21 measurement circuit of fig.10 and fig.22 measurement circuit of fig.11 and fig.23 measurement circuit of fig.12 and fig.24 downloaded from: http:///
technical note 6/12 www.rohm.com 201 1.10 - rev . b ? 2011 rohm co., ltd. all rights reserved. b d 3 3 c 0 aw f p , b d 5 0 c 0 aw f p bl ock di agr ams pin no. pin name function 1 ctl output control pin 2 vcc power supply pin 3 n.c. n.c. pin 4 vo output pin 5 n.c. n.c. pin fin gnd gnd t o p view pack ag e dime nsi o n fig.25 n.c. ctl 3 vo 5 gnd n.c. vcc fin tsd vref ocp 2 1 4 r2r1 3 5 r1,r2:feed back resister driver vref:bandgap reference ocp:over current protection circuit tsd:thermal shut down circuit driver:power transistor driver downloaded from: http:///
technical note 7/12 www.rohm.com 201 1.10 - rev . b ? 2011 rohm co., ltd. all rights reserved. b d 3 3 c 0 aw f p , b d 5 0 c 0 aw f p vcc ic 200k 200k ctl 1k vo vcc 34k (BD33C0AWFP) 56.6k (bd50c0awfp) 10k i n p u t / output eq uiv a le nt circ u it di agr ams ctl pin vo pin vcc pin 15 k downloaded from: http:///
technical note 8/12 www.rohm.com 201 1.10 - rev . b ? 2011 rohm co., ltd. all rights reserved. b d 3 3 c 0 aw f p , b d 5 0 c 0 aw f p th erm a l d e si gn fig.26 fig.27(reference data) when using at temperatures over ta=25 , please refer to the heat reducing characteristics shown in fig.26 and fig.27. the ic characteristics are closely related to the temperature at which the ic is used, so it is necessary to operate the ic at temperatures less than the maxi mum junction temperature tjmax. fig.26 and fig.27 show the acceptable loss and heat reducing characteristics of the to252-5 package. even when the ambient temperature ta is a normal temperature (25 ), the chip (junction) temperatur e tj may be quite high so please operate the ic at temperatures less than the acceptable loss pd. the calculation method for power consum ption pc(w) is as follows :(fig.27 ) pc=(vcc vo) io+vcc ib acceptable loss pd pc solving this for load current io in order to operate within the acceptable loss, it is then possible to find the maximum load current io max with respect to the applied voltage vcc at the time of thermal design. calculation example) when ta=85 BD33C0AWFP:vcc=8.3v,vo=3.3v bd50c0awfp:vcc=10v,vo=5.0v please refer to the above information and keep thermal desig ns within the scope of acceptable loss for all operating temperature ranges. the power consumption pc of the ic when there is a short circuit (short between vo and gnd) is : pc=vcc (ib+ishort) io pd vcc ib vcc vo vcc: vo: io: ib: ishort: input voltage output voltage load current circuit current short current fig.27 : ja=26.0 / w -38.4mw/ 25 =4.80w 85 =2.496w io 2.496 10 ib 5 io 498.2ma (ib:0.5ma) 0 1 2 3 4 5 0 25 50 75 100 125 150 ambient temperature:ta[ ] power dissipaton:pd[w] 1.30 mounted on a rohm standard board board size : 70 L 70 L 1.6 L copper foil area :7 L 7 L to252-5 ja=96.2( /w) 0 1 2 3 4 5 0 25 50 75 100 125 150 ambient temperature:ta[ ] power dissipaton:pd[w] 1.5 3.50 4.0 mounted on a rohm standard board board size : 70 L 70 L 1.6 L copper foil area :7 L 7 L 2-layer board (back surface copper foil area :15 L 15 L ) 2-layer board (back surface copper foil area :70 L 70 L ) 4-layer board (back surface copper foil area :70 L 70 L ) : ja=67.6 /w : ja=35.7 /w : ja=26.0 /w (please refer to fig.9,21 for ib.) (please refer to fig.5,17 for ishort.) downloaded from: http:///
technical note 9/12 www.rohm.com 201 1.10 - rev . b ? 2011 rohm co., ltd. all rights reserved. b d 3 3 c 0 aw f p , b d 5 0 c 0 aw f p not e s for use 1. absolute maximum ratings use of the ic in excess of absolute maximum ratings (suc h as the input voltage or operating temperature range) may result in damage to the ic. assumptions should not be made regarding the state of the ic (e.g., short mode or open mode) when such damage is suffered. if operational values ar e expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the ic. 2. electrical characteristics described in these specifications may vary, depending on temperature, supply voltage, external circuits and other conditions. therefore, be sure to check a ll relevant factors, includin g transient characteristics. 3. gnd potential the potential of the gnd pin must be the minimum potential in the system in all operating conditions. ensure that no pins are at a voltage below the gnd at any time, regardless of transient characteristics. 4. ground wiring pattern when using both small-signal and large- current gnd traces, the two ground trac es should be routed separately but connected to a single ground potential within the applicati on in order to avoid variations in the small-signal ground caused by large currents. also ensur e that the gnd traces of external components do not cause variations on gnd voltage. the power supply and ground lines must be as short and thick as possible to reduce line impedance. 5. inter-pin shorts and mounting errors use caution when orienting and positioning the ic for mounting on printed circuit boards. improper mounting may result in damage to the ic. shorts between output pins or between output pins and the power supply or gnd pins (caused by poor soldering or foreign objects) may result in damage to the ic. 6. operation in strong electromagnetic fields using this product in strong electromagnetic fields ma y cause ic malfunction. caution should be exercised in applications where strong electromagnetic fields may be present. 7. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from a jig or fixture during the evaluation process. to prevent damage from static discharge, ground t he ic during assembly and use similar precautions during transport and storage. 8. thermal consideration use a thermal design that allows for a sufficient margin in light of the pd in act ual operating conditions. consider pc that does not exceed pd in actual operating conditions. (pd pc) tjmax : maximum junction temperature=150 , ta : peripheral temperature[ ] , ja : thermal resistance of package-ambience[ /w], pd : package power dissipation [w], pc : power dissipation [w], vcc : input voltage, vo : output voltage, io : load, ib : bias current package power dissipation : pd (w)=(tjmax ta ) / ja power dissipation : pc (w)=(vcc vo) io+vcc ib 9. vcc pin insert a capacitor(vo 5v:capacitor 1f ~ , vo 5v:capacitor 2.2f ~)between the vcc and gnd pins. the appropriate capacitance value varies by application. be sure to allow a sufficient margin for input voltage levels. electric capacitance ceramic capacitors,low esr capacitors ic downloaded from: http:///
technical note 10/12 www.rohm.com 201 1.10 - rev . b ? 2011 rohm co., ltd. all rights reserved. b d 3 3 c 0 aw f p , b d 5 0 c 0 aw f p 10. output pin it is necessary to place capacitors between each output pi n and gnd to prevent oscillat ion on the output. usable capacitance values range from 1f to 1000f. ceramic capacitors can be used as long as their esr value is low enough to prevent oscillation (0.001 ? to 20 ? ). abrupt fluctuations in input vo ltage and load conditions may affect the output voltage. output capacitance values should be det ermined only through sufficient testing of the actual application. 11. ctl pin do not make voltage level of chip enable pin keep floating level, or in between vthh and vthl. otherwise, the output voltage would be unstable or indefinite. 12. for a steep change of the vcc voltage because mos fet for output transistor is used when an input voltage change is very steep, it may evoke large current. when selecting the value of external circ uit constants, please make sure that the operation on the actual application takes these conditions into account. 13. for an infinitesimal fluct uations of output voltage. at the use of the application that infinitesimal fluctuations of output voltage caused by so me factors (e.g. disturbance noise, input voltage fluctuations, load fluc tuations, etc.), please take enough meas ures to avoid some influence (e.g. insert the filter, etc.). 14. over current protection circuit (ocp) the ic incorporates an integrated over-cu rrent protection circuit that operates in accordance with the rated output capacity. this circuit serves to protect the ic from damag e when the load becomes shorted. it is also designed to limit output current (without latching) in the event of a large and instantaneous current flow from a large capacitor or other component. these protection circuits are effective in preventing damage due to sudden and unexpected accidents. however, the ic should not be used in applications characterized by the continuous or transitive operation of the protection circuits. 15. thermal shutdown circuit (tsd) the ic incorporates a built-in thermal shutdown circuit, which is designed to turn the ic off completely in the event of thermal overload. it is not designed to pr otect the ic from damage or guarantee it s operation. ics should not be used after this function has activated, or in applications where the operation of this circuit is assumed. vcc=4.3v 25v(BD33C0AWFP)/6v 25v(bd50c0awfp) ta =-4 0 +105 cin=2.2 f 100 f cout=1 f 100 f . . . ia c_ unstable operating region stable operating region cout_esr vs io(reference data) cin vs cout(reference data) operation notes 10 measurement circuit BD33C0AWFP vcc=4.3v 25v vo=3.3v ta =-4 0 +105 io=0a 1a c ci 2.2 unstable operating region stable operating region bd50c0awfp vcc=6v 25v vo=5v ta =-4 0 +105 io=0a 1a c ci stable operating region cout(1.0 f ) vo ctl gnd cin v ctl (5v) BD33C0AWFP (2.2 f ) esr io(rout) ( 0.001 ?) vcc BD33C0AWFP(4.3v 25v) n.c. bd50c0awfp(6v 25v) bd50c0awfp (1.0 f ) downloaded from: http:///
technical note 11/12 www.rohm.com 201 1.10 - rev . b ? 2011 rohm co., ltd. all rights reserved. b d 3 3 c 0 aw f p , b d 5 0 c 0 aw f p 16. applications or inspection processes where the potential of the v cc pin or other pins may be reversed from their normal state may cause damage to the ic's internal circuitry or elements. use an output pin capacitance of 1000f or lower in case vcc is shorted with the gnd pin while the external capacito r is charged. insert a diode in series with vcc to prevent reverse current flow, or insert bypass diodes between vcc and each pin. 17. positive voltage surges on vcc pin a power zener diode should be inserted between vcc and gnd for protection against voltage surges of more than 35v on the vcc pin. 18. negative voltage surges on vcc pin a schottky barrier diode should be inserted between vcc and gnd for protection against voltages lower than gnd on the vcc pin. 19. output protection diode loads with large inductance components may cause reverse current flow during startup or shutdown. in such cases, a protection diode should be insert ed on the output to protect the ic. 20. regarding input pins of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. pn junctions are formed at the intersection of th ese p layers with the n layers of other elements, creating parasitic diodes and/or transistors. fo r example (refer to the figure below): when gnd > pin a and gnd > pin b, the pn junction operates as a parasitic diode when gnd > pin b, the pn junction o perates as a parasitic transistor parasitic diodes occur inevitably in the structure of the ic , and the operation of these parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. accordingly, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (a nd thus to the p substrate) should be avoided. example of simple monolithic ic architecture parasitic elements (pin a) parasitic elements or transistors (pin b) c b e n p n n p+ p+ parasitic elements or transistors p substrate (pin b) c b e transistor (npn) (pin a) n p n n p+ p+ resistor parasitic elements p gnd gnd gnd n vcc gnd vcc gnd downloaded from: http:///
technical note 12/12 www.rohm.com 201 1.10 - rev . b ? 2011 rohm co., ltd. all rights reserved. b d 3 3 c 0 aw f p , b d 5 0 c 0 aw f p or der in g p a rt num be r b d x x c 0 a w f p - e 2 part no. output voltage 33: 3.3v output 50:5.0v current capacity c0a:output 1a shutdown switch w : with switch none : without switch package fp : to252 packaging specification e2: embossed tape and reel downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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